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The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
0.9 mm Pitch Vertical Mating Board-to-Wire Connectors
DF24 Series
Space-saving
Double row socket
Double row header (SMT)
Low-profile
Double row socket
Features
11. Space saving
Small contact pitch (0.9 mm) together with vertical mating direction allows high density mounting of the board components.
3.8
12. Low profile
Two-level contact location and horizontal wire exits allow a low profile of 3.8 mm, when fully.
8.2 Double row header (SMT)
13. Reliable mating/un-mating
Complete vertical mating, with both sides self-aligned, is confirmed with tactile "click" sensation.
14. High contact reliability
2-point socket contact, with a long wipe (0.55 mm) assures highly reliable electrical and mechanical connection.
Long contact wipe
0.55mm
Two-point socket contact
15. Prevention of solder wicking
Despite its low-profile, solder wicking is prevented by the nickel barrier and solder collection areas.
16. Self-alignment and side-pull protection
The walls of the double row socket assembly will self-align during the mating and protect header and socket assemblies from a accidental side-pull on the wires.
Contact - header
17. Simplified un-mating
A pull strap for double row socket version may be selected for easier un-mating. Self-alignment and side-pull protection
18. Contact deformation protection
Flat contact blades on the headers are supported by the insulator's walls, protecting them from deformation during handling.
Socket contacts Wall Contact blades
19. Board placement with automatic equipment
Supplied on reels containing 1,000 assemblies.
10. RoHS compliant
All components and materials comply with the requirements of the EU Directive 2002/95/EC.
Applications
Notebook computers, miniature office automation devices, miniature consumer devices, cameras, recording devices and other devices requiring vertical mating reliable connectors. Contact deformation protection
B297
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. DF24 Series0.9 mm Pitch Vertical Mating Board-to-Wire Connectors
Product Specifications
Rating
Current rating (Note 1) Voltage rating Wire size AWG28 :1A AWG30 :0.5A AWG32~36 :0.3A 80V AC Operating temperature range Operating humidity range Storage temperature range Storage humidity range -35c to +85c (Note 2) Relative humidity 20% to 80% -10c to +60c (Note 3) Relative humidity 40% to 70% (Note 3)
Item
1.Insulation resistance 2.Withstanding voltage 3.Contact resistance 500 M ohms min.
Specification
100V DC 250V AC/one minute 1 mA, 20 mV max. No flashover or insulation breakdown. 30 mo max.
Conditions
4.Insertion-Extraction force (per contact) 0.12N min., 2N max. 5.Vibration 6.Humidity No electrical discontinuity of 1s or more. Contact resistance: 30 mo max. Insulation resistance: 250 Mo min. Contact resistance: 30 mo max. Insulation resistance: 500 Mo min.
Measured with a steel pin of 0.15mm thickness Frequency: 10 to 55 Hz, single amplitude of 0.75mm, 2 hours, 3 axis 96 hours at temperature of 402c and humidity of 90% to 95%. Temperature: -55c +5c to +35c +85c +5c to +35c Time: 30 2 to 3 30 2 to 3 (Minutes) 30 cycles Reflow: At the recommended temperature profile Manual soldering: 350c for 3 seconds 5 cycles
7.Temperature cycle
8.Durability (mating / un-mating) Contact resistance: 30 mo max. 9.Resistance to soldering heat No deformation of components affecting performance.
Note 1: Current rating for header is 1A. Note 2: Includes temperature rise caused by current flow. Note 3: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating temperature range and humidity range covers non-conducting condition of installed connectors in storage, shipment or during transportation. Note 4: Information contained in this catalog represents general requirements for this Series. Contact us for the drawings and specifications for a specific part number shown.
Materials and Finishes
Product
Socket Crimp contact Header Pull strap
Component
Insulators Contact-socket Insulator Contact-blade Pull strap
Material
Polyamide Phosphor bronze Polyamide Phosphor bronze PET
Finish
Color : Black Gold plated Color : Black Gold plated ------------
Remarks
UL94V-0 ---------- UL94V-0 ---------- ----------
Ordering information
Connectors
DF24 # - * DS - 0.9 C
1 2 3 4 5 6 4 Connector type
DS : Double-row socket DP : Double-row header
1 Series Name : DF24 2 Form type
Pin headers A : Standard type Sockets Blank : Standard type A : Pull strap version
5 Contact pitch : 0.9 mm 6 Housing type
C : Crimp housing V : Straight SMT header PTB : Pull strap (Note)
3 Number of contacts : 40, 50
Note: The pull strap is an optional.
Contacts
DF24 - 2830 SCF A
1 1 Applicable conductor
2830 : AWG 28 to 30 3234 : AWG 32 to 34 0036 : AWG 36
2 2 Packaging
3
SCF : Socket contact / reel
3 Plating
A : Gold plated
B298
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search Pitch Vertical Mating Board-to-Wire Connectors DF24 Series0.9 mm at www.hirose-connectors.com, or contact your Hirose sales representative.
Double-row header (SMT)
A Contact P=0.9 0.15
Contact
P=0.9 A B
3.3
3.8 4.8
PCB mounting pattern
Contact No.1 P=0.90.03 A0.05 0.50.03 2.30.05
5.40.05
Specification number (51): Embossed tape packaging (1,000 pieces per reel).
Contact No.2
Unit: mm Part number
DF24A-40DP-0.9V(**) DF24A-50DP-0.9V(**)
CL No.
687-3208-0-** 687-3209-2-**
Number of contacts
40 50
A
17.1 21.6
B
19.6 24.1
Packaging
1,000 pcs. / reel 1,000 pcs. / reel
RoHS YES
Packaging specifications
20.1 120.1 1.750.1
40.1
A
Section A-A 20.5 Part number label
C0.1
B0.1 A0.3
O21
0.8
0.40.1 A 4.550.15
D +2 0 (D+6) MAX
Unreeling direction
( O80 ) ( O380 )
O13
0.2
Unit: mm Part number
DF24A-40DP-0.9V(**)
Number of contacts
40 50
A
32 44
B
28.4 40.4
C
14.2 20.2
D
32.4 44.4
3.4
.5 O1
.05 +0 0
B299
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. DF24 Series0.9 mm Pitch Vertical Mating Board-to-Wire Connectors
Double-row socket
A
A
No. of contacts indicator
1
B C Contact Contact D P=0.9 3.05 2.85 8.2 6.5 3.45 4.8
Unit: mm Part number
DF24B-40DS-0.9C DF24B-50DS-0.9C
CL No.
687-3301-5 687-3302-8
Number of contacts
40 50
A
22.1 26.2
B
18.75 23.25
C
17.1 21.6
D
21.1 25.2
Packaging 100 pcs. / bag 100 pcs. / bag
RoHS YES
Double-row socket (Pull strap)
A 0.3
A
1
No. of contacts indicator B C 1.2 Contact Contact D P=0.9 3.05 2.85 8.2 6.5 3.45 4.8
4.5
Unit: mm Part number
DF24BA-50DS-0.9C
CL No.
687-3304-3
Number of contacts
50
A
27.4
B
23.25
C
21.6
D
25.2
Packaging 100 pcs. / bag
RoHS YES
Note: Refer to page 5 for pull strap tab.
B300
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search Pitch Vertical Mating Board-to-Wire Connectors DF24 Series0.9 mm at www.hirose-connectors.com, or contact your Hirose sales representative.
Crimp contact
1.03 0.85
Part number
CL No.
Applicable wire size Packaging Quantity
28 - 30 32 - 34 36
Reel 20,000
Finish
RoHS
DF24-2830SCFA 687-3001-1 DF24-3234SCFA 687-3004-0 DF24-36SCFA 687-3003-7
Gold plated YES
4.6
Applicable wire (Tin plated annealed copper wire)
Wire size (Stranded wire conductor)
0.8
Jacket diameter
0.6mm max 0.4mm max
AWG28 (7 / 0.127mm) AWG30 (7 / 0.107mm) AWG32 (7 / 0.087mm) AWG36 (7 / 0.057mm)
1.95 0.55
Note: When using other than the recommended wire, contact your nearest Hirose representative.
3
Tools
O1
Type Autmatic
Description
Applicator Press unit
Part number
AP105-DF24-2830S AP105-DF24-3234S AP105-DF24-36S CM-105 DF-C-PO(B)
CL No.
901-4602-5 901-4592-3 901-4606-6 901-0005-4 550-0179-2
Applicable contacts
DF24-2830SCFA DF24-3234SCFA DF24-36SCFA
------------------------
t=0.12
Contact extraction tool
DF24-****SCFA
Pull strap
t=0.1 A
Applicable socket [DF24BA-50DS-0.9C]
Seal B
4
Unit: mm
Part number DF24-50DS-PTB CL No. 687-3300-2 Number of contacts 50 A 25 B 75 Packaging 500 pcs. / bag RoHS YES
Before attachment of the pull strap
Pull strap attached
B301
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. DF24 Series0.9 mm Pitch Vertical Mating Board-to-Wire Connectors
Pull Strap Attachment Procedure
1 With the adhesive side of the pull strap facing upward, pass both ends of the strap through the elongated openings at both ends of the socket.
Adhesive side
Elongated opening
Elongated opening
Socket
2 Peel-off the protective paper on one side and place one end of the strap over exposed adhesive (as illustrated below), using the remaining paper side as the alignment guide.
Protective paper
3 Peel-off the remaining protective paper and place the other end of the strap over the adhesive, using the already attached end as the alignment guide.
Completed
B302
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search Pitch Vertical Mating Board-to-Wire Connectors DF24 Series0.9 mm at www.hirose-connectors.com, or contact your Hirose sales representative.
Usage recommendations and Precautions
1. Recommended temperature profile (Including Lead-free solder)
Temperature(c) 250 240 220 190 170
Reflow conditions Preheating: 18010c 60~20sec. Soldering: 250c max. 240cmin. 20sec. max. 220cmin. 60sec. max.
200
150 Preheating 100 Soldering
50
0
50
100
150
200
250
Time(S)
Note 1: Up to 2 cycles of Reflow soldering are possible under the same conditions, providing that there is a return to normal temperature between the first and second cycle. Note 2: The temperature profile indicates the board surface at the point of contacts with the connector terminals. 2.Recommended manual soldering Manual soldering: 30010c for 3 seconds 3.Recommended screen thickness and opening area ratio (Pattern area ratio) 4. Board warpage 5. Cleaning conditions 6. Wire preparation and contact crimping 7. Precautions Thickness: 0.12mm Opening area ratio: 80% Maximum of 0.03mm at the connector center, with both ends of the connector as reference points. Refer to "Nylon Connector Use Handbook". Refer to "Nylon Connector Use Handbook". The crimp contacts are of a very small form and because of this, crimping should be performed carefully based on the content of the Crimping Conditions Table and the Crimping Quality Standards Manual. Removal of the inserted socket contacts * Using the socket contact extraction tool (DF-C-PO(B) ) carefully lift the contact retention tab on the insulator housing, as shown on the Fig.1 and pull-out the wire. * Lift the tab ONLY enough to remove the contact. Exercise caution NOT to deflect too much. * The tab should return to its original position after the contact is removed. * The tab must be in its original position before inserting the new socket contact.
Contact retention tab
Contact extraction tool DF-C-PO(B)
Fig. 1. Contact Removal
B303
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. DF24 Series0.9 mm Pitch Vertical Mating Board-to-Wire Connectors
7. Precautions
Connector Mating/Un-mating * Hold the socket at both ends (as illustrated on Fig.2) when mating or un-mating. The mating/unmating of the connectors must be within the indicated angle of 20 on both axis.
20
20
DO NOT MATE / UN-MATE HOLDING BY THE WIRES.
Hold here
Fig. 2. Mating / Un-mating
Bundling of the Wires * To avoid wire damage or termination faults bundling of the wires should be at the distance of 20 mm min. from the socket (Fig. 3-1) * When bundling at the distance less than the recommended 20 mm, it is critical to avoid sharp bend radius (Fig. 3-2) or apply stretching or twisting forces (Fig. 3-3)
Bundling close to socket
Do not stretch or twist
Sharp bend Fig. 3-1 Fig. 3-2 Fig. 3. Bundling requirements
* Do not mate/un-mate connectors when not mounted on the board. * Do not use connector as the only support for the board. * Do not use flux compounds when hand soldering. * Slight color shade difference of the insulator bodies will not affect the form, fit or function of the connectors.
Fig. 3-3
B304

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